Technical Specifications
| Processor | Up to 2 x 3rd Generation Xeon Scalable processors with up to 40 cores per processor Direct Contact Liquid Cooling (DCLC) |
| Chipset Options | C620 Series Chipsets |
| Accelerator | Up to 4 single-width 150 W or 4 double-width 300 W accelerators in front, 2 single-width 75 W accelerators in rear |
| Memory | 16GB RDIMM, 3200MT per second, dual rank 32GB RDIMM, 3200MT per second, Dual Rank, 16Gb BASE |
| Hard Drive | 120GB SSD SATA Boot 6Gbps 512n 2.5in Hot plug Drive, 3.5in HYB CARR (or 1.2T, 2.4T, 600G, 2T,4T,6T, etc.) |
| Front Tray | Up to 8 x (6.35 cm) 2.5-inch SAS or SATA or NVMe (HDD or SSD), Up to 122.88 TB, Up to 6 x (6.35 cm) 2.5-inch NVMe (SSD), up to 92.16 TB |
| Internal Controller | PERC H745, HBA355I, H345, H755, H755N |
| External Controller | PERC H840, HBA355E |
| Port Inclusion | Network Options 2x 1 GbE LOM and 1x OCP 3.0 (8 PCIe lanes) (optional) |
| Front Port 1 x Dedicated iDRAC Direct micro-USB Port, 1x USB 2.0 Port, 1x VGA Port | |
| Rear Port 1x USB 2.0 Ports, 1 USB 3.0 Port, 1 Serial Port (Optional), 2 RJ-45 Ports, 1 VGA Port (Optional for Liquid Cooling Configurations) | |
| Internal Ports: 1 USB 3.0 Port | |
| PCIe Riser | Up to 8 PCIe 4.0 slots (up to 6 x16 + 2 x8) |
| Embedded Systems Management | iDRAC9, Express |
| Power Supply | 1400 W Platinum AC or 240 HVDC, 2400 W Platinum AC or 240 HVDC, Hot Swap Power Supply with Full Redundancy Option |
| Processor Main Frequency | 2.8G |
| CPU | Xeon Platinum 8362 2.8G, 32C or 64T, 11.2GT per second, 48M 265W DDR4 to 3200 |
| HDD | 16 X (6.35 cm) 2.5-inch or 12 x (8.89 cm) 3.5-inch SATA or SAS or SSD |
| RAID | C7, No RAID configured for HDDs or SSDs (mixed driver types allowed) |
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